公司概况

ISSCC 2020:极低功耗事件驱动型IoT芯片

A 57nW Software-Defined Always-On Wake-Up Chip for IoT Devices with Asynchronous Pipelined Event-Driven Architecture and Time-Shielding Level-Crossing ADC

ISSCC 2021:极低功耗事件驱动型AIoT芯片

148nW General-Purpose Event-Driven Intelligent Wake-Up Chip for AIoT Devices Using Asynchronous Spike-Based Feature Extractor and Convolutional Neural Network

ISSCC 2021:超低功耗湿度/电容传感芯片

1.5μW 0.135pJ•%RH2 CMOS Humidity Sensor Using Adaptive Range-Shift Zoom CDC and Power-Awareness Floating Inverter Amplifier Array

ISSCC 2021:高性能ADC芯片

A 79dB-SNDR 167dB-FoM Bandpass ∆∑ ADC Combining N-Path Filter with Noise-Shaping SAR

ISSCC 2022:极低功耗异步脉冲神经网络芯片

An 82nW 0.53pJ/SOP Clock-Free Spike Neural Network with 40μs Latency for AIoT Wake-Up Functions Using Ultimate-Event-Driven Bionic Architecture and Computing in Memory Technique

ISSCC 2022:极低功耗嵌入式SRAM存储器

Single-Mode 6T CMOS SRAM Macros with Keeper-Loading-Free Peripherals and Row-Separate Dynamic Body Bias Achieving 2.53fW/bit Leakage for AIoT Sensing Platforms

ISSCC 2023:SRAM存算一体AI芯片

A 22-nm Delta-Sigma Computing-In-Memory (ΔΣCIM) SRAM Macro with Near-Zero-Mean Outputs and LSB-First ADCs Achieving 21.38TOPS/W for 8b-MAC Edge AI Processing

ISSCC 2023:免校准高精度高能效模拟信号链

A 7.9fJ/Conversion-Step and 37.12aFrms  Pipelined-SAR Capacitance-to-Digital Converter with kT/C Noise Cancellation and Incomplete-Settling-Based Correlated Level Shifting

ISSCC 2023:极低功耗时钟电路

A 0.954nW 32kHz Crystal Oscillator in 22nm CMOS with Gm-C-Based Current Injection Control

ISSCC会议每年2月中旬在美国旧金山召开,是国际公认的规模最大、领域内最权威、水平最高的芯片设计领域学术会议,被业界誉为“集成电路设计国际奥林匹克盛会”,每年约有200项芯片实测成果入选,约四成左右的芯片成果来自于国际芯片巨头公司,例如:英特尔、三星、台积电、AMD、英伟达、高通、博通、ADI、TI、联发科等,其余六成左右的芯片成果来自于高校和科研院所;历史上入选ISSCC的成果代表着当年度全球领先水平,展现出芯片技术和产业的发展趋势,多项“芯片领域里程碑式发明”在ISSCC首次披露,如:世界上第一个集成模拟放大器芯片(1968年)、第一个8位微处理器芯片(1974年)和32位微处理器芯片(1981年)、第一个1Gb内存DRAM芯片(1995年)、第一个多核处理器芯片(2005年)等。